Glass - steel hybrid elements under four point bending test

Elastic modulus of a triple-stranded stainless steel arch wire via three- and four-point bending.

The modulus of elasticity (E) was determined in simple three- and four-point bending for an 0.0175" (3 X 0.008") stainless steel arch wire. Using variable light loads (10-160 g) to limit the elastic deflection of a wire to less than 5% of its beam length, the force-deflection profiles were determined for three nominal span lengths (L = 0.35", 0.75", and 1.00") in three-point bending and three n...

Cluster Analysis of Acoustic Emission Signals for Carbon/Epoxy Composite in Four-point Bending Test (RESEARCH NOTE)

Due to the extensive use of composites in various industries and the fact that defects reduce ultimate strength and efficiency during operation, detection of failures in composite parts is very important. The aim of this paper is to use Acoustic Emission (AE) non-destructive method in four-point bending test of carbon/epoxy composite to analyze and examine the failure mechanisms. This method is...

Damage Detection of Carbon Fiber-reinforced Concrete Under Bending Test

Acoustic Emission and Modal Frequency Variation in Concrete Specimens under Four-Point Bending

The Acoustic Emission (AE) and Dynamic Identification (DI) techniques were applied simultaneously, in an original way, to examine the stress dependent damage progress in pre-notched concrete beams tested in four-point bending. The damage mechanisms were characterized by analyzing the AE signals registered during the tests, conducted by increasing the specimen’s vertical deflection. In particula...

Four point bending setup for characterization of semiconductor piezoresistance.

We present a four point bending setup suitable for high precision characterization of piezoresistance in semiconductors. The compact setup has a total size of 635 cm(3). Thermal stability is ensured by an aluminum housing wherein the actual four point bending fixture is located. The four point bending fixture is manufactured in polyetheretherketon and a dedicated silicon chip with embedded piez...